At Computex 2024 there was a bevy of announcements from the world’s leading chip companies, including AMD. The company used its Computex keynote to talk up its AI capabilities, from the datacenter to the consumer. For AMD, it was especially important on the consumer side to show how the company’s processors are still competitive in this age of AI on the PC.
There are two Ryzen AI 300 series parts, the Ryzen AI 9 HX 370 and Ryzen AI 9 365. These two very similar parts have minor specification differences but effectively the same TDPs in a range from 15 to 54 watts. The HX 370 is a 12-Core Zen 5 CPU clocked at 5.1 GHz while the 365 is a 10-Core Zen 5 CPU clocked at 5 GHz. There is also a 2MB difference in CPU cache and a slight difference in GPU performance. These are both powered by AMD’s RDNA 3.
AMD claims that it already has 100-plus PC models carrying the Ryzen AI 300 series that will be available from most of the major OEMs starting this month. Dell is surprisingly missing from this list. I saw some of these systems in person at Computex and was especially impressed with what AMD was able to achieve in partnership with ASUS on the Zenbook S 16, which is one of the most impressive notebooks in terms of thinness and weight that I have seen in years.
The X870 series will also come with support for higher memory clock speeds using AMD’s EXPO profiles, which is another way for AMD to encourage high-end gamers to make the switch. That all said, the new Ryzen 9000 series will still likely be a drop-in upgrade for anyone using a high-end X670E motherboard already capable of supporting a 170-watt TDP CPU.